包装：袋 类别：焊接，拆焊，返修产品 焊接，拆焊，返修尖头，喷嘴 描述：PLATO SLDER TIP SLANT 3.0 MM

TECHSPRAY

Infrared Emitting Diode

文件：149.77 Kbytes 页数：2 Pages

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FlipKY 0.5Amp, 30Volt

Description International Rectifiers FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and c

文件：156.64 Kbytes 页数：5 Pages

IRF

FlipKYTM

Description International Rectifiers FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and ca

文件：156.49 Kbytes 页数：5 Pages

IRF