IR0530CSP中文资料IRF数据手册PDF规格书

Description

International Rectifiers FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding leads enabling designers to strategically place the diodes on the PCB. This design not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency.

特性 Features

• Ultra Low VF To Footprint Area

• Very Low Profile (<0.6mm)

• Low Thermal Resistance

• Supplied Tested And On Tape & Reel

Applications

• Reverse Polarity Protection

• Current Steering

• Freewheeling

• Flyback

• Oring