首页 >HRC0203B-NTRF-E>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SiliconSchottkyBarrierDiodeforRectifying | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SILICONSCHOTTKYBARRIERDIODEFORRECTIFYING | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. •UltrasmallResinPackage(URP)issuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhigheffifiencyrectifying. •UltrasmallResinPackage(URP)issuitableforhighdensitysurfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiode | KEXINGuangdong Kexin Industrial Co.,Ltd 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforRectifying | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhigheffifiencyrectifying. •MPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforRectifying Features •Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. •MPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|
