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HMC554LC3BRF/IF射频/中频RFID的射频混频器规格书PDF中文资料

HMC554LC3B
厂商型号

HMC554LC3B

参数属性

HMC554LC3B 封装/外壳为12-VFCQFN 裸露焊盘;包装为散装;类别为RF/IF射频/中频RFID的射频混频器;产品描述:GAAS MMIC FUNDAMENTAL

功能描述

GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz

封装外壳

12-VFCQFN 裸露焊盘

文件大小

273.37 Kbytes

页面数量

6

生产厂商 Hittite Microwave Corporation
企业简称

HITTITE

中文名称

Hittite Microwave Corporation官网

原厂标识
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-6-24 22:59:00

人工找货

HMC554LC3B价格和库存,欢迎联系客服免费人工找货

HMC554LC3B规格书详情

General Description

The HMC554LC3B is a general purpose double balanced mixer in a leadless RoHS compliant SMT package that can be used as an upconverter or downconverter between 11 and 20 GHz. This mixer is fabricated in a GaAs MESFET process, and requires no external components or matching circuitry. The HMC554LC3B provides excellent LO to RF and LO to IF isolation due to optimized balun structures. The RoHS compliant HMC554LC3B eliminates the need for wire bonding, and is compatible with high volume surface mount manufacturing techniques.

Features

High LO/RF Isolation: 46 dB

Passive Double Balanced Topology

Low Conversion Loss: 7 dB

Wide IF Bandwidth: DC - 6 GHz

Robust 1,000V ESD, Class 1C

12 Lead Ceramic 3x3mm SMT Package: 9mm2

Typical Applications

The HMC554LC3B is ideal for:

• Point-to-Point Radios

• Point-to-Mulit-Point Radios & VSAT

• Test Equipment & Sensors

• Military End-Use

产品属性

  • 产品编号:

    HMC554LC3B

  • 制造商:

    Analog Devices Inc.

  • 类别:

    RF/IF,射频/中频和 RFID > 射频混频器

  • 包装:

    散装

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    12-VFCQFN 裸露焊盘

  • 供应商器件封装:

    12-CSMT(3x3)

  • 描述:

    GAAS MMIC FUNDAMENTAL

供应商 型号 品牌 批号 封装 库存 备注 价格
ADI(亚德诺)
24+
NA/
7350
原装进口,原厂直销!当天可交货,支持原型号开票!
询价
ADI/亚德诺
24+
NA/
1618
优势代理渠道,原装正品,可全系列订货开增值税票
询价
ADI
24+
QFN
80000
只做自己库存,全新原装进口正品假一赔百,可开13%增
询价
HITTITE
14+
QFN
10
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
ADI/亚德诺
22+
66900
原封装
询价
ADI
21+
标准封装
500
进口原装,订货渠道!
询价
ADI
24+
20000
全新、原装、现货
询价
2017+
SMD
1585
只做原装正品假一赔十!
询价
ADI(亚德诺)
24+
N/A
10000
原装,正品
询价
ADI
24+
QFN
18700
ADI一级代理商全新原装进口现货
询价