Chip data sheet V1.0

文件：773.13 Kbytes 页数：10 Pages

HMSEMI

华之美半导体

DC-DC降压IC/车充IC

HMsemi

华之美半导体

Logic level TOPFET

DESCRIPTION Monolithic temperature and overload protected logic level power MOSFET in TOPFET2 technology assembled in a 3 pin surface mount plastic package. FEATURES ● TrenchMOS output stage ● Current limiting ● Overload protection ● Overtemperature protection ● Protection latched reset by

文件：30.17 Kbytes 页数：6 Pages

PHI

PHI

Silicon NPN triple diffusion planar type

文件：89.2 Kbytes 页数：3 Pages

PANASONIC

松下

3V 900MHZ LINEAR AMPLIFIER MODULE

Product Description The RF3117 is a high-power, high-efficiency linear amplifier module targeting 3V handheld systems. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in dual-mode 3

文件：118.76 Kbytes 页数：6 Pages

RFMD

威讯联合