零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
---|---|---|---|---|
QuartzSMD,Ceramic | AURIS auris-GmbH | AURIS | ||
QuartzSMD,Epoxy | AURIS auris-GmbH | AURIS | ||
312SeriesofDecoders GeneralDescription The312decodersareaseriesofCMOSLSIsforremotecontrolsystemapplications.Theyarepairedwith312seriesofencoders.Forproperoperationapairofencoder/decoderwiththesamenumberofaddressanddataformatshouldbeselected(refertotheencoder/decodercrossr | HoltekHolmate Technology Corp. (Holtek) 合泰 | Holtek | ||
StandardRectifier FEATURES ·Verylowleakagecurrent ·Verylowforwardvoltagedrop ·Improvedthermalbehaviour APPLICATIONS ·Diodeformainrectification ·Forsingleandthreephasebridgeconfigurations | ISCInchange Semiconductor Company Limited 无锡固电无锡固电半导体股份有限公司 | ISC | ||
BIPOLARLINEARINTEGRATEDCIRCUIT(3VAM/FMIF-MPX) 3VAM/FMIF-MPX(forDigitalTuningSystem) | KECKEC CORPORATION KEC株式会社 | KEC | ||
BIPOLARLINEARINTEGRATEDCIRCUIT(3VAM/FMIF-MPX) 3VAM/FMIF-MPX(forDigitalTuningSystem) | KECKEC CORPORATION KEC株式会社 | KEC | ||
BIPOLARLINEARINTEGRATEDCIRCUIT(3VAM/FMIF-MPX) 3VAM/FMIF-MPX(forDigitalTuningSystem) | KECKEC CORPORATION KEC株式会社 | KEC | ||
IndustrialGradeCyberSecurityAppliancewithIntel짰Atom??E3845Processor | LANNER Lanner All Rights Reserved. | LANNER | ||
IndustrialGradePoENetworkAppliancewithIntel짰Atom??E3845Processor | LANNER Lanner All Rights Reserved. | LANNER | ||
LCDModuleUserManual | TOPWAYShenzhen TOPWAY Technology Co., Ltd 深圳拓普微深圳市拓普微科技开发有限公司 | TOPWAY | ||
CMOSDualOperationalAmplifier | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | NSC | ||
CMOSDualOperationalAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CMOSDualOperationalAmplifier | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | NSC | ||
CMOSDualOperationalAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CMOSDualOperationalAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CMOSDualOperationalAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CMOSDualOperationalAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
CMOSDualOperationalAmplifier | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | NSC | ||
CMOSDualOperationalAmplifier | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | TI1 | ||
4DigitUniversalTimerwithclock | BOWIN BOWIN ELECTRONIC CO. | BOWIN |
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
HUBBELLWIRINGDEVICES |
23+ |
421567 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
询价 | |||
HUBBELL WIRING DEVICES |
24291+ |
con |
12 |
现货常备产品原装可到京北通宇商城查价格 |
询价 | ||
HubbellWiringDevice-Kell |
新 |
62 |
全新原装 货期两周 |
询价 | |||
Hubbell Wiring Device-Kellems |
2022+ |
58 |
全新原装 货期两周 |
询价 | |||
HUBBELL |
24+ |
con |
100 |
现货常备产品原装可到京北通宇商城查价格https://www.jbchip.com/index |
询价 | ||
HUBBELL PREMISE WIRING |
标准封装 |
62140 |
一级代理原装正品现货期货均可订购 |
询价 | |||
HBL7594 |
17 |
17 |
询价 |
相关规格书
更多- HC00
- HC04
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- HC21025
- HC245
- HC273
- HC32A
- HC3-5502B-5
- HC3-5560-5
- HC374
- HC4050
- HC4052
- HC4066
- HC4316
- HC4P5502B
- HC4P5504B
- HC4P5504B-5
- HC541
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- HC55121IB
- HC5513BIP
- HC55142IM
- HC5515IM
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相关库存
更多- HC02
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- HC20512
- HC244
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- HC3-5502A-5
- HC3-5504B-5
- HC373
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- HC4067
- HC4538
- HC4P5502B-5
- HC4P5504B1-5
- HC4P5509B-5
- HC5503CB
- HC5503TCB
- HC5513BIM
- HC55140IM
- HC5515CM
- HC5517CB
- HC55181AIM
- HC55181DIM
- HC55183ECM
- HC55184ECM
- HC55185
- HC55185BIM
- HC55185DIM
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- HC5526
- HC5549CM
- HC573A
- HC595
- HC68T1M2
- HC86