丝印：GI7；Package：DSBGA；LM48820 Ground-Referenced, Ultra Low Noise, Fixed Gain, 95mW Stereo Headphone Amplifier

1FEATURES 2• Available in Space Saving 0.4mm Pitch DSBGA Package • Fixed Logic Levels • Ground Referenced Outputs • High PSRR • Ultra Low Current Shutdown Mode • Improved Pop and Click Circuitry Eliminates Noises During Turn-On and Turn-Off outputTransitions • No Output Coupling Capacitor

文件：547.32 Kbytes 页数：18 Pages

TI

德州仪器

丝印：GI7；Package：DSBGA；LM48820 Ground-Referenced, Ultra Low Noise, Fixed Gain, 95mW Stereo Headphone Amplifier

1FEATURES 2• Available in Space Saving 0.4mm Pitch DSBGA Package • Fixed Logic Levels • Ground Referenced Outputs • High PSRR • Ultra Low Current Shutdown Mode • Improved Pop and Click Circuitry Eliminates Noises During Turn-On and Turn-Off outputTransitions • No Output Coupling Capacitor

文件：547.32 Kbytes 页数：18 Pages

TI

德州仪器

丝印：GI7；Package：DSBGA；LM48820 Ground-Referenced, Ultra Low Noise, Fixed Gain, 95mW Stereo Headphone Amplifier

1FEATURES 2• Available in Space Saving 0.4mm Pitch DSBGA Package • Fixed Logic Levels • Ground Referenced Outputs • High PSRR • Ultra Low Current Shutdown Mode • Improved Pop and Click Circuitry Eliminates Noises During Turn-On and Turn-Off outputTransitions • No Output Coupling Capacitor

文件：547.32 Kbytes 页数：18 Pages

TI

德州仪器

丝印：GI7；Package：DSBGA；LM48820 Ground-Referenced, Ultra Low Noise, Fixed Gain, 95mW Stereo Headphone Amplifier

1FEATURES 2• Available in Space Saving 0.4mm Pitch DSBGA Package • Fixed Logic Levels • Ground Referenced Outputs • High PSRR • Ultra Low Current Shutdown Mode • Improved Pop and Click Circuitry Eliminates Noises During Turn-On and Turn-Off outputTransitions • No Output Coupling Capacitor

文件：547.32 Kbytes 页数：18 Pages

TI

德州仪器

HIGH CURRENT PLASTIC RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High forward current capability ♦ Diffused junction ♦ Construction utilizes void-free molded plastic technique ♦ High surge current capability ♦ High temperature soldering guaranteed: 250°C/10 seconds,

文件：38.48 Kbytes 页数：2 Pages

GE

GE Industrial Company

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

文件：76.51 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世科技威世科技半导体

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC TYPI

文件：79.33 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世科技威世科技半导体

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TY

文件：82.08 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世科技威世科技半导体

High Current Axial Plastic Rectifier

FEATURES • Low forward voltage drop • Low leakage current, IR less than 0.1 μA • High forward current capability • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TY

文件：82.08 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世科技威世科技半导体

HIGH CURRENT PLASTIC RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High forward current capability ♦ Diffused junction ♦ Construction utilizes void-free molded plastic technique ♦ High surge current capability ♦ High temperature soldering guaranteed: 250°C/10 seconds,

文件：38.48 Kbytes 页数：2 Pages

GE

GE Industrial Company