FSB50250S分立半导体产品的功率驱动器模块规格书PDF中文资料

FSB50250S属于分立半导体产品的功率驱动器模块。由安森美半导体制造生产的FSB50250S功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。

特性 Features

• 500V 1.0A 3-phase FRFET inverter including high voltage integrated circuit (HVIC)

• 3 divided negative dc-link terminals for inverter current sensing applications

• HVIC for gate driving and undervoltage protection

• 3/5V CMOS/TTL compatible, active-high interface

• Optimized for low electromagnetic interference

• Isolation voltage rating of 1500Vrms for 1min.

• Surface mounted device package

• Moisture Sensitive Level(MSL) 3

General Description

FSB50250S is a tiny smart power module (SPM®) based on FRFET technology as a compact inverter solution for small power motor drive applications such as fan motors and water suppliers. It is composed of 6 fast-recovery MOSFET (FRFET), and 3 half-bridge HVICs for FRFET gate driving. FSB50250S provides low electromagnetic interference (EMI) characteristics with optimized switching speed. Moreover, since it employs FRFET as a power switch, it has much better ruggedness and larger safe operation area (SOA) than that of an IGBT-based power module or one-chip solution. The package is optimized for the thermal performance and compactness for the use in the built-in motor application and any other application where the assembly space is concerned. FSB50250S is the most solution for the compact inverter providing the energy efficiency, compactness, and low electromagnetic interference.