FS100R12KT4_B11数据手册分立半导体产品的晶体管-IGBT-模块规格书PDF

描述 Description

EconoPACK™ 2 1200V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode and PressFIT Contact Technology
Replacement product including a NTC will be launched in June 2017, name: FS100R12N2T4_B11

特性 Features

·High power density
·Established Econo module concept
·Integrated temperature sensor available
·Low stray inductance module design
·RoHS-compliant modules

应用 Application

    Also available as variation with Soldering connection technology: FS100R12KT4Please also find our EiceDRIVER™ HV Gate Driver Family. Including our EiceDRIVER™ Enhanced Driver ICs for your easy and reliable design.The 1EDI60I12AF EiceDRIVER™ compact is a fast and powerful Gate Driver suitable for your IGBT Module applications. (Evalboard available)FS100R12KT4_B11Data Sheet (712 KB, EN/CN)EN/DEEN/JAParametricFS100R12KT4_B11Configuration SixpackIC(nom) / IF(nom)  100.0A VCE(sat)(Tvj=25°C typ) 1.75V VF(Tvj=25°C typ) 1.7V Housing EconoPACK™ 2Dimensions(width) 45.0mm Dimensions(length) 107.5mm Data SheetTitleSizeDateVersionFS100R12KT4_B11 (chinese/english)EN/CNEN/DEEN/JA712 KB09 十二月 201302_00Product BrochureTitleSizeDateVersion1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionApplication of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014Industrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009Mounting instruction for PressFIT with forked pinsENDE1.2 MB01 八月 201602_01等效热路模型CNEN500 KB25 十一月 2013如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionEasy & Econo Power ModulesEN433 KB27 四月 201608_00PressFIT - Our established, reliable mounting technologyEN616 KB27 四月 201608_00EditorialsTitleSizeDateVersionCorrelating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00On the loss - softness trade-off: Are different chip versions needed for softness-improvement?EN731 KB31 一月 2011Reliability of PressFIT connectionsEN472 KB06 六月 20081200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current ModulesEN141 KB07 二月 2014PressFIT Technology, a Solderless Method for Mounting Power ModulesEN377 KB24 一月 200601_00Improving Efficiency in AC drives: Comparison of Topologies and Device TechnologiesEN892 KB31 五月 2014Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 五月 2014The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Saving money: SiC in UPS applicationsEN759 KB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00Material Content Data SheetTitleSizeDateVersionMCDS - Econo2BEN36 KB06 一月 201403_00销售产品名称FS100R12KT4_B11OPNFS100R12KT4B11BOSA1产品状态discontinued在线订购封装名称AG-ECONO2-6无铅产品no无卤no通过无铅认证yes包装规格10包装类型TRAY评估板评估板系列描述状态2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.·For equipping EiceDRIVER™ 2ED300C17-S / -ST

简介

FS100R12KT4_B11属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FS100R12KT4_B11晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。