FS100R07N3E4_B11数据手册Infineon中文资料规格书

描述 Description

EconoPACK™ 3 650V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology

特性 Features

·Increased blocking voltage capability to 650V
·High Short Circuit Capability, Self Limiting Short Circuit Current
·T(vj op) = 150°C
·Integrated NTC temperature sensor
·Copper Base Plate
·Standard Housing

应用 Application

     Also available as variation with Soldering connection technology: FS100R07N3E4Please select a matching HV Gate Driver IC from our EiceDRIVER™ Portfolio.With Infineon EiceDRIVER™ Enhanced and Compact Driver ICs as well as EiceDRIVER™ Safe Driver Boards we provide a broad spectrum of solutions for reliable and efficient controls of IGBT Modules.FS100R07N3E4_B11Data Sheet (957 KB, EN/CN)EN/DEEN/JAParametricFS100R07N3E4_B11Configuration SixpackIC(nom) / IF(nom)  100.0A VCE(sat)(Tvj=25°C typ) 1.55V VF(Tvj=25°C typ) 1.55V Housing EconoPACK™ 3Dimensions(width) 62.0mm Dimensions(length) 122.0mm Data SheetTitleSizeDateVersionFS100R07N3E4_B11 (chinese/english)EN/CNEN/DEEN/JA957 KB02 十二月 201302_00Product BrochureTitleSizeDateVersion1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionIndustrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00电力电子模块内部NTC的使用CNEN586 KB26 十一月 2013Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009Mounting instruction for PressFIT with forked pinsENDE1.2 MB01 八月 201602_01等效热路模型CNEN500 KB25 十一月 2013如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionEasy & Econo Power ModulesEN433 KB27 四月 201608_00PressFIT - Our established, reliable mounting technologyEN616 KB27 四月 201608_00EditorialsTitleSizeDateVersion650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand timeEN191 KB31 一月 2011Correlating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00Reliability of PressFIT connectionsEN472 KB06 六月 2008PressFIT Technology, a Solderless Method for Mounting Power ModulesEN377 KB24 一月 200601_00Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 五月 2014The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00Material Content Data SheetTitleSizeDateVersionMCDS - Econo3BEN12 KB13 十二月 201603_01销售产品名称FS100R07N3E4_B11OPNFS100R07N3E4B11BOSA1产品状态active and preferred在线订购封装名称AG-ECONO3-4无铅产品no无卤no通过无铅认证yes包装规格10包装类型TRAYSimulation ToolTitleSizeDateVersionIPOSIMEN2.7 MB09 十二月 201607_09PressFIT TechnologyCustomers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications. 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