| 订购数量 | 价格 |
|---|---|
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首页>FI-X30SSLA-HF-R2500>芯片详情
FI-X30SSLA-HF-R2500芯片价格JAE/航空电子坤融电子2部
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产品属性
- 类型
描述
- 制造商编号
：FI-X30SSLA-HF-R2500
- NumberofPositions
：30pos.
- ContactPitch(mm)
：1.0mm
- ConnectorType
：Boardsidereceptacle
- ConnectorStyle
：Rightangle
- WireTerminationStyle
：-
- PCBMountingMethod
：Soldering(SMT)
- ApplicableWire
：-
- ApplicableWireSize
：-
- ApplicableWireInsulationDiameter(mm)
：-
- MaterialofContact
：Copperalloy
- FinishofContactinConnectingArea
：GoldplatingoverNickel
- FinishofContactinTerminalArea
：-
- FinishofContactinPCBMountingArea
：TinplatingoverNickel
- MaterialofHousing
：Heatresistingplastic(UL94V-0)
- LockingFeature
：Mechanicallock
- PCBMountedHeight(mm)
：2.3
- ApplicableContacts
：-
- PackagingType
：Embossedtapepackaging
- QuantityinTheStandardPackaging(pieces)
：2
供应商
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