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首页>FI-SEB20P-HFE-E3000>芯片详情
FI-SEB20P-HFE-E3000芯片价格JAE/航空电子中天科工二部
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产品属性
- 类型
描述
- 型号
：FI-SEB20P-HFE-E3000
- NumberofPositions
：20pos.
- ContactPitch(mm)
：1.25mm
- ConnectorType
：Boardsidereceptacle
- ConnectorStyle
：Rightangle
- WireTerminationStyle
：-
- PCBMountingMethod
：Soldering(SMT)
- NumberofRows
：1
- ApplicableWire
：-
- ApplicableWireSize
：-
- ApplicableWireInsulationDiameter(mm)
：-
- RemarksonApplicableWire
：-
- MaterialofContact
：Copperalloy
- FinishofContactinConnectingArea
：GoldplatingoverNickel
- FinishofContactinTerminalArea
：-
- FinishofContactinPCBMountingArea
：TinorTin-alloyplatingoverNickel
- MaterialofHousing
：GlassfilledLCP(UL94V-0)
- PCBMountedHeight(mm)
：1.48
- ApplicableContacts
：-
- PackagingType
：Embossedtapepackaging
- QuantityinTheStandardPackaging(pieces)
：3000pieces/reel
供应商
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