FF600R12IS4F数据手册分立半导体产品的晶体管-IGBT-模块规格书PDF

描述 Description

1200V PrimePACK™2 dual IGBT module with fast IGBT2 Fast, SiC Diodes for high frequency switching and NTC.

特性 Features

·Low Switching Losses
·V(cesat) with positive Temperature Coefficient
·4kV AC 1min Insulation
·Package with CTI > 400
·High Creepage and Clearance Distances
·Substrate for Low Thermal Resistance
·UL recognized

应用 Application

  This Module can be driven by the dedicated Evaluation Board.2ED250E12-FThis Module can be combined with the dedicated Evaluation Board.MA300E12Please select a matching HV Gate Driver IC from our EiceDRIVER™ Portfolio.With Infineon EiceDRIVER™ Enhanced and Compact Driver ICs as well as EiceDRIVER™ Safe Driver Boards we provide a broad spectrum of solutions for reliable and efficient controls of IGBT Modules.FF600R12IS4FData Sheet (1.9 MB, EN/CN)EN/DEEN/JAParametricFF600R12IS4FConfiguration DualIC(nom) / IF(nom)  600.0A VCE(sat)(Tvj=25°C typ) 3.2V VF(Tvj=25°C typ) 1.6V Housing PrimePACK™ 2Dimensions(width) 89.0mm Dimensions(length) 172.0mm Data SheetTitleSizeDateVersionFF600R12IS4F (chinese/english)EN/CNEN/DEEN/JA1.9 MB10 十二月 201302_05Product BrochureTitleSizeDateVersion1EDI EiceDRIVER™ Compact 300 milEN216 KB09 五月 201601_00Application NotesTitleSizeDateVersionIndustrial IGBT Modules Explanation of Technical InformationENJA2.2 MB03 十二月 201501_02利用单极栅电压驱动IGBTCNEN384 KB03 十一月 201501_00Application Note IGBT Definition of Junction TemperatureEN84 KB09 四月 2009电力电子模块内部NTC的使用CNEN586 KB26 十一月 2013Assembly Instructions PrimePACK™ ModulesEN2.3 MB27 三月 201402_00PrimePACK™ IGBT 模块 的适配器板CNEN1.6 MB25 十一月 2013Evaluation Driver Board for 1200 V PrimePACK™EN1 MB14 二月 2011等效热路模型CNEN500 KB25 十一月 2013如何正确计算并最大限度减小 IGBT 的死区时间CNEN1.5 MB26 八月 2013Application of screen print templates to paste thermal grease within IGBT modulesEN489 KB10 二月 2014Aging stability of various heatconducting pastes for use with modules without baseplatesEN111 KB10 二月 2014Series connection of IGBTsEN28 KB10 二月 2014Paralleling of IGBTsEN28 KB10 二月 2014Product BriefTitleSizeDateVersionIHM, IHV Modules & PrimePACK™EN452 KB27 四月 201608_00EditorialsTitleSizeDateVersionCorrelating NTC-Reading and Chip-Temperature in Power Electronic ModulesEN297 KB04 十一月 201501_00Properties of a New PrimePACK™ IGBT Module ConceptEN213 KB07 二月 2014Efficiency improvement with silicon carbide based power modulesEN275 KB31 一月 2011Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplatesEN704 KB31 五月 2014The challenge of accurately analyzing thermal resistancesEN1.1 MB31 五月 2014Application BrochureTitleSizeDateVersionSolutions for Wind Energy SystemsEN5.4 MB18 四月 2013Solutions for Industrial DrivesEN3.4 MB15 五月 201710_00Solutions for construction, commercial and agricultural vehicles (CAV)EN6.7 MB30 七月 2014Solutions for Uninterruptible Power Supply (UPS) SystemsEN3.4 MB15 五月 201709_00Solutions for Traction SystemsEN2.9 MB15 五月 201709_00Product Selection GuideTitleSizeDateVersionSelection Guide - Industrial and general purpose gate driver ICsEN3.5 MB15 五月 201701_00Product CatalogueTitleSizeDateVersionShort Form Catalog - May 2017EN2.9 MB12 五月 201703_00销售产品名称FF600R12IS4FOPNFF600R12IS4FBOSA1产品状态discontinued在线订购封装名称AG-PRIME2-1无铅产品no无卤no通过无铅认证yes包装规格3包装类型TRAY评估板评估板系列描述状态MA300E12IGBT Modules, Gate DriverEvaluation Adapter board containing a booster stage for driving 1200V PrimePACK™ in single or parallel configuration. ·For connecting 1200V PrimePACK™ IGBT Modules and driver boards

简介

FF600R12IS4F属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FF600R12IS4F晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。