FF1200R12IE5P数据手册分立半导体产品的晶体管-IGBT-模块规格书PDF

描述 Description

PrimePACK™2 1200 V, 1200 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT interconnection technology, Emitter Controlled 5 diode, NTC and pre-applied Thermal Interface Material.

特性 Features

• Extended operating temperature (Tvj op = 175°C)
• Output current increased by more than 25% in the same footprint
• Copper bonds for high current carrying capabilities
• Sintering of chips for highest power cycling capabilities
• Total losses reduced by up to 20%
• Package with CTI > 400
• Pre-applied Thermal Interface Material

优势:
• Increase in power density by up to 25%
• Up to 10 times longer lifetime
• Less cooling effort for same output power
• Enables higher system overload conditions

简介

FF1200R12IE5P属于分立半导体产品的晶体管-IGBT-模块。由制造生产的FF1200R12IE5P晶体管 - IGBT - 模块绝缘栅双极晶体管 (IGBT) 是三端功率半导体器件，主要用作电子开关，兼具高效率和快速切换优点。作为模块，IGBT 配置为非对称式桥； 升压、降压和制动斩波器；全桥、三电平和三相逆变器。有些器件内置了用于监控温度的 NTC 热敏电阻。IGBT 模块可根据最大功率、集电极电流、集射击穿电压和配置进行区分。