Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-220AC and

文件：143.69 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

High Voltage Ultrafast Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C,

文件：144.25 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

High Voltage Ultrafast Rectifier

• Power pack • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for D2PAK (TO-263AB package)) • Solder dip 275 °C m

文件：142.81 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世

High Voltage Ultrafast Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C,

文件：144.25 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世