Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format.

APPLICATIONS The fcCSP package is an attractive option for applications in which both performance and form factor are critical. Examples include high-performance mobile devices (including 5G), infotainment and ADAS for automotive and AI. Further, the benefits from low inductance and increased rou

文件：953.7 Kbytes 页数：2 Pages

amkor

安靠科技

ON
SOT252

ON

上传：上海世强芯半导体有限公司

ON
TO-252AA

ON

上传：深圳市壹芯创科技有限公司

NIEC
TO-220F

NIEC

上传：深圳市华康联电子科技有限公司（销售一部）

NIEC
TO-220F

NIEC

上传：深圳市华康联电子科技有限公司（销售一部）