亚洲电子生产设备暨微电子工业展览会

展会中文名称：亚洲电子生产设备暨微电子工业展览会
主办单位：工业和信息化部国际经济技术合作中心、励展博览集团
展会日期：2026年10月27-29日
展会地点：深圳国际会展中心（宝安）
展会主页：www.nepconasia.com
展会介绍（中）：NEPCON ASIA 汇聚来自全球超过600+电路板组装、智慧工厂、半导体封测、光模块、智能汽车、触控显示,具身智能等跨行业先进生产设备及技术供应商，全景展示创新产品先进制造技术与降本增效方案，是企业学习新技术,发掘新产品,探索新趋势的电子制造行业盛会。
展品预计规模（中）：
1.    展示面积：100,000m²  同期展会总展示面积：180,000m²
2.    参展企业：600+      同期展会总参展企业：3600+
3.    专业观众：77,000+   同期展会总专业观众：170,000+
4.    国际观众：3,000+    同期展会总国际观众:  5,000+
5.    现场活动：40+       同期展会总会议活动:  100+
展品范围（中）：
    SMT 表面贴装 
    焊接、点胶及喷涂
    测试测量
    SMT周边
    精密仪器设备
    半导体封装测试设备及材料
    半导体封装技术
    半导体测试技术
    半导体材料
    光模块制造设备
    汽车电子元器件
    汽车核心零部件与电子电器技术
    汽车电子生产设备
    汽车先进材料

2026新看点！三大赛道展示内容
光模块制造工艺示范区：锚定800G/1.6T/3.2T 高速光模块赛道，绕 COB 封装、模组装配、测试老化三大关键制程，集中展出配套专用设备、核心材料与整线量产方案，帮助广大企业切入高增长赛道、优化光模块产线与管理。
呈现光模块制造3大工艺段，2天专业论坛多个细分主题，1000名来自光模块制造专业观众。

汽车电子：
汽车电子生产示范展示区
    全流程示范产线，覆盖四大设备赛道
    全覆盖精准核心观众定向，直击车企 Tier1 与制造端
    国际化平台赋能，全产业链生态协同加持
展示范围
    SMT/DIP设备
    线束与高压电子设备
    半导体封装与测试设备
    环境与可靠性测试设备

具身智能：
ROBOTECH 2026智能机器人博览会
助力广大企业加速落地工业场景应用与优化产线管理
2026具身智能机器人产业发展大会汇聚行业大咖学者，深耕技术创新与生产工艺，研讨机器人本体、运动控制及核心零部件新工艺，分享具身机器人在电子制造的创新突破与场景落地。
展示范围：
    机器人本体
    机器人供应链
    机器人生产及检测设备
    机器人及零部件代工厂
 
扫码立即预登记
参观咨询，请联系：
孙梅 女士
励展博览集团
电话: 400 650 5611
手机号码：+86 182 3187 0376
传真: +86 10 8518 8016
邮箱：mei.sun@rxglobal.com 


Event Title: NEPCON ASIA 2026

Organizational structure: Center for international economic and technological cooperation ministry of industry and information technology, RX China

Event Dates: October 27-29, 2026

Venue：Shenzhen World Exhibition &Convention Center [Bao'an]

Event Website: www.nepconasia.com 

About : 
NEPCON ASlA brings together over 600+ global suppliers of advanced production equipment and technologies across cross-sector industries including PCBA assembly, smart factories, semiconductor packaging and testing, Optical Module, smart vehicles, touch and display, and embodied intelligence, showcasing innovative products, advanced manufacturing technologies, and cost-efficiency & capacity enhancement solutions in a panoramic display. This is a premier event in the electronics manufacturing industry for enterprises to learn about new technologies, discover new products, and explore new trends.

Estimated Scale：
1.    Show Space：100,000sqm      Total Exhibition Area[Co-located Shows]: 180,000sqm
2.    Number of Exhibitors: 600+   Total Exhibitor Number[Co-located Shows]: 3,600+
3.    Number of Visitors: 77,000+   Total Visitor Number[Co-located Shows]: 170,000+
4.    Number of International Visitors: 3.000+  Total International Visitors[Co-located Shows]: 5,000+
5.    0nsite Events: 40+           Total Concurrent Conferences[Co-located Shows]: 100+

Exhibition Scope:
    SMT Mount Technology &Equipment
    Soldering/ Dispensing &Coating Equipment Test
    Measurement Equipment 
    Others of SMT
    Precision Instruments and Equipment
    Manufacturing Equipment
    Semiconductor Packaging and Test Equipment / Material
    Semiconductor Packaging Technology
    Semiconductor Test Technology
    Semiconductor Materials
    Optical Module Manufacturing Equipment
    Automotive Electronic Components
    Core Automotive Components & Electrical and Electronic Technologies
    Automotive Electronics Manufacturing Equipment
    Advanced Automotive Materials


2026 Show Highlights:

Embodied Intelligence: 
ROBOTECH 2026 
ROBOTECH 2026 integrates the full industry chain of Embodied AI, covering three major application scenarios: industrial, commercial, and special operators. It establishes an international exchange platform that combines technology demonstration, business negotiation, ecosystem cooperation, and trend forecasting. The exhibition gathers the technical innovation power of key research institutions in South China, global innovative enterprises, and overseas industrial resources. It builds a complete closed-loop of 'Academic R&D – Scenario Validation – Mass Production,' helping Embodied AI walk out of the laboratory and achieve large-scale deployment in the three real-world scenarios. 

Exhibit Scope:  
    Robots 
    Robot Supply Chain
    Robot Manufacturing and Testing Equipment
    Robot and Component Contract Manufacturer

Optical Module:
Optical Module manufacturing Process Demo Zone
Targeting the high-speed optical module market of 800G/1.6T/3.2T, covering the three key manufacturing processes of COB packaging, module assembly, and testing & aging. The zone will feature dedicated special-purpose equipment, core materials, and complete production line mass-production solutions to help enterprises enter this high-growth sector and optimize their optical module production lines and management.
Presenting Optical Module Manufacturing 3 major process stages
2 days of professional forums Multiple sub-topics
1,000+ professional visitors from optical module manufacturing 

Automotive Electronics:
Automotive Electronics Manufacturing Demo Line:
    Full-process demo line covering four major equipment sectors
    Precision targeting of core visitors, directly reaching automotive Tier 1 suppliers and manufacturers 
    International platform empowerment with full industry chain ecosystem collaboration
Display Scope:
    SMT/DlP equipment
    Semiconductor packaging & testing equipment
    Wire harness and high-voltage electronic equipment
    Environmental and reliability testing equipment



For Visitors: 
Mr. Walden Li
Email:  walden.li@rxglobal.com
Mobile/WhatsApp/WeChat: +86 136-5125-1335