EasyPACK module with Trench/Fieldstopp IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC

文件：665.57 Kbytes 页数：10 Pages

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EasyPACK Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled 3 Diode und PressFIT / NTC

文件：825.69 Kbytes 页数：11 Pages

Infineon

英飞凌

EasyPACK Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled 3 Diode und PressFIT / NTC

文件：825.69 Kbytes 页数：11 Pages

Infineon

英飞凌

650 V、100 A 三电平 IGBT 模块

EasyPACK™ 2B 650 V, 100 A 3-level phase leg IGBT module with TRENCHSTOP™ IGBT3, Emitter Controlled 3 diode, NTC and PressFIT Contact Technology. • Increased blocking voltage capability to 650 V\n• Low inductive design\n• Low switching losses\n• Low VCEsat\n• Al2O3substrate with low thermal resistance\n• Compact design\n• PressFIT contact technology\n• Rugged mounting due to integrated mounting clamps\n\n优势:\n• Compact module concept\n• Optim;

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Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：IGBT MOD 650V 117A 300W

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英飞凌