首页>EP1C6>规格书详情

EP1C6集成电路(IC)的FPGA(现场可编程门阵列)规格书PDF中文资料

EP1C6
厂商型号

EP1C6

参数属性

EP1C6 封装/外壳为256-BGA;包装为托盘;类别为集成电路(IC)的FPGA(现场可编程门阵列);产品描述:IC FPGA 185 I/O 256FBGA

功能描述

Cyclone Series Device Thermal Resistance

封装外壳

256-BGA

文件大小

157.18 Kbytes

页面数量

7

生产厂商 Altera Corporation
企业简称

ALTERA阿尔特

中文名称

阿尔特拉公司官网

原厂标识
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-6-24 22:58:00

人工找货

EP1C6价格和库存,欢迎联系客服免费人工找货

EP1C6规格书详情

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.

This chapter contains the following sections:

■ “Cyclone III Device Family Features” on page 1–1

■ “Cyclone III Device Family Architecture” on page 1–6

■ “Reference and Ordering Information” on page 1–12

产品属性

  • 产品编号:

    EP1C6F256C6N

  • 制造商:

    Intel

  • 类别:

    集成电路(IC) > FPGA(现场可编程门阵列)

  • 系列:

    Cyclone®

  • 包装:

    托盘

  • 电压 - 供电:

    1.425V ~ 1.575V

  • 安装类型:

    表面贴装型

  • 工作温度:

    0°C ~ 85°C(TJ)

  • 封装/外壳:

    256-BGA

  • 供应商器件封装:

    256-FBGA(17x17)

  • 描述:

    IC FPGA 185 I/O 256FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
ALTERA
2016+
QFP240
5621
只做原装,假一罚十,内存,闪存,公司可开17%增值税
询价
ALTERA
23+
BGAQFP
8659
原装公司现货!原装正品价格优势.
询价
ALTERA
1950+
QFP
6852
只做原装正品现货!或订货假一赔十!
询价
ALTERA
24+
QFP144
8762
公司原厂原装现货假一罚十!特价出售!强势库存!
询价
ALTERA
2015+
SOP/DIP
19889
一级代理原装现货,特价热卖!
询价
ALTERA
23+
TQFP-144
9896
询价
ALTERA
20+
QFP
67500
原装优势主营型号-可开原型号增税票
询价
ALTERA
23+
BGA
62
原装正品现货
询价
ALTERA
24+
PQFP
12223
ALTERA专营品牌全新原装热卖
询价
ALTERA(阿尔特拉)
24+
标准封装
10163
我们只是原厂的搬运工
询价