F316R

HCMOS3.2x2.5mm1.8VSMDOscillator

F316R

HCMOS3.2x2.5mm1.8VSMDOscillator

F316R

HCMOS3.2x2.5mm1.8VSMDOscillator

F316R

HCMOS3.2x2.5mm1.8VSMDOscillator

F-316X

ChassisMountSingleSecondary

FC-316

ScreenedRoomFilters

FDG316P

P-ChannelLogicLevelPowerTrenchMOSFET

GeneralDescription ThisP-ChannelLogicLevelMOSFETisproducedusingFairchildSemiconductorsadvancedPowerTrenchprocessthathasbeenespeciallytailoredtominimizeon-stateresistanceandyetmaintainsuperiorswitchingperformance. Thesedevicesarewellsuitedforlowvoltageandbatte

FIT-CLEAR-316

CustomerSpecification

Construction 1)TubingTypeHeatShrinkableTubing 2)TubingMaterialIrradiatedPVDF(Kynar) 3)MinimumSuppliedID(In)0.187 4)MaximumRecoveredID(In)0.093 5)NominalRecoveredWallThickness(In)0.010 6)Color(s)CLEAR ApplicableSpecifications 1)ULStandard224150°C VW-1 2)O

GR316

DiscCeramicCapacitors

-GeneralPurpose -IdealForUseinNon-critical Coupling,BypassandFilterApplications -ConformallyCoated -RadialLeads

GRM316

ChipMonolithicCeramicCapacitors

ChipMonolithicCeramicCapacitors ForGeneralPurposeGRMSeries ■Features 1.Higherresistanceofsolder-leachingdueto theNi-barrieredtermination,applicablefor reflow-soldering,andflow-soldering (GRM18/21/31typeonly). 2.TheGRMseriesisaleadfreeproduct. 3.Small