Package：径向；包装：卷带（TR） 类别：电容器 薄膜电容器 描述：CAP FILM 3.3UF 10% 100VDC RADIAL

PANASONIC

松下

Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

文件：277.48 Kbytes 页数：13 Pages

STMICROELECTRONICS

意法半导体

5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

文件：36.21 Kbytes 页数：3 Pages

STMICROELECTRONICS

意法半导体

Universal Serial Bus USB Audio Playback Recording Peripheral APRP

文件：254.95 Kbytes 页数：44 Pages

PHI

PHI