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ST1335中文资料意法半导体数据手册PDF规格书

PDF无图
厂商型号

ST1335

功能描述

Memory Micromodules General Information for D1, D2 and C Packaging

文件大小

277.48 Kbytes

页面数量

13

生产厂商

STMICROELECTRONICS

中文名称

意法半导体

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2026-1-29 9:03:00

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ST1335规格书详情

DESCRIPTION

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).

■ Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip

– Electrical contacts

– Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensions and contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

产品属性

  • 型号:

    ST1335

  • 制造商:

    STMICROELECTRONICS

  • 制造商全称:

    STMicroelectronics

  • 功能描述:

    Memory Micromodules General Information for D1, D2 and C Packaging

供应商 型号 品牌 批号 封装 库存 备注 价格
LONEON
24+
DIP-4
60000
询价
ST
23+
原厂原封
16900
正规渠道,只有原装!
询价
ST
24+
NA
200000
原装进口正口,支持样品
询价
LONEON
23+
DIP-4
50000
全新原装正品现货,支持订货
询价
XG
13+
DIP-3
16738
原装分销
询价
ST
26+
NA
60000
只有原装 可配单
询价
LONEON
2223+
DIP-4
26800
只做原装正品假一赔十为客户做到零风险
询价
ST
24+
原厂原封
16900
支持样品,原装现货,提供技术支持!
询价
LONEON
24+
DIP-4
880000
明嘉莱只做原装正品现货
询价
LONEON
2021+
DIP-4
25635
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价