DS315W中文资料PDF规格书
DS315W规格书详情
Features
● Schottky Barrier Chip
● Ideally Suited for Automatic Assembly
● Low Power Loss, High Efficiency
● Surge Overload Rating to 2 0A Peak
● For Use in Low Voltage Application
● Guard Ring Die Construction
● Plastic Case Material has UL Flammability
Classification Rating 94V-O
Mechanical Data
● Weight: 0.01 grams (approx.)
● Case: SOD-123, Molded Plastic
● Terminals: Solder Plated, Solderable per MIL-STD-750, Method 2026
● Polarity: Cathode Band or Cathode Notch
● Marking: Type Number
● Lead Free: For RoHS / Lead Free Version
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
DALLAS原装 |
1629+ |
BGA |
9860 |
原装优势主营型号-可开原型号增税票 |
询价 | ||
MAXIM |
2016+ |
QFN |
3500 |
本公司只做原装,假一罚十,可开17%增值税发票! |
询价 | ||
MAXIM/美信 |
2022 |
QFP |
80000 |
原装现货,OEM渠道,欢迎咨询 |
询价 | ||
DALLAS |
23+ |
8890 |
价格优势、原装现货、客户至上。欢迎广大客户来电查询 |
询价 | |||
MAXIM/美信 |
标准封装 |
58998 |
一级代理原装正品现货期货均可订购 |
询价 | |||
MAXIM/美信 |
23+ |
NA/ |
3610 |
原装现货,当天可交货,原型号开票 |
询价 | ||
DALLAS |
23+ |
BGA |
9896 |
询价 | |||
MAXIM |
23+ |
TEBGA |
8888 |
专做原装正品,假一罚百! |
询价 | ||
MAXIM |
2016+ |
QFN |
6523 |
只做进口原装现货假一赔十! |
询价 | ||
DALLAS |
2305+ |
原厂封装 |
12500 |
15年芯片行业经验/只供原装正品:0755-83267371邹小姐 |
询价 |
