DRA71数据手册TI中文资料规格书

描述 Description

The DRA71x processor is offered in a 538-ball, 17×17-mm, 0.65-mm ball pitch (0.8mmspacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array(BGA) package.
The architecture is designed to deliver high-performance concurrencies for automotiveapplications in a cost-effective solution, providing full scalability from the DRA75x (\"Jacinto 6EP\" and \"Jacinto 6 Ex\"), DRA74x \"Jacinto 6\" and DRA72x \"Jacinto 6 Eco\" family of infotainmentprocessors, including graphics, voice, HMI, multimedia and smartphone projection mode capabilities.
Programmability is provided by a single-core Arm Cortex-A15 RISC CPU withNeon™ extensions and a TI C66x VLIW floating-point DSPcore. The Arm processor lets developers keep control functions separate from other algorithmsprogrammed on the DSP and coprocessors, thus reducing the complexity of the system software.
Additionally, TI provides a complete set of development tools for the Arm, and DSP,including C compilers and a debugging interface for visibility into source code execution.
Cryptographic acceleration is available in all devices. All other supported securityfeatures, including support for secure boot, debug security and support for trusted executionenvironment are available on High-Security (HS) devices. For more information about HS devices,contact your TI representative.
The DRA71x Jacinto 6 Entry processor family is qualified according to the AEC-Q100standard.
The device features a simplified power supply rail mapping which enables lower costPMIC solutions.
The DRA71x processor isoffered in a 538-ball, 17×17-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals)with Via Channel™ Array (VCA) technology, ball grid array (BGA) package.
The architecture is designed to deliver high-performance concurrencies for automotiveapplications in a cost-effective solution, providing full scalability from the DRA75x (\"Jacinto 6EP\" and \"Jacinto 6 Ex\"), DRA74x \"Jacinto 6\" and DRA72x \"Jacinto 6 Eco\" family of infotainmentprocessors, including graphics, voice, HMI, multimedia and smartphoneprojection mode capabilities.
Programmability is provided by a single-core Arm Cortex-A15 RISC CPU with Neon™extensions and a TI C66x VLIW floating-point DSP core. The Arm processor lets developers keepcontrol functions separate from other algorithms programmed on the DSP and coprocessors, thusreducing the complexity of the system software.
Additionally, TI provides a complete set of development tools for the Arm, and DSP,including C compilers and a debugging interface for visibility into source code execution.
Cryptographic acceleration is available in all devices. All other supported securityfeatures, including support for secure boot, debug security and support for trusted executionenvironment are available on High-Security (HS) devices. For more information about HS devices,contact your TI representative.
The DRA71x Jacinto 6Entry processor family is qualified according to the AEC-Q100 standard.
The device features are simplified power supply rail mapping which enables lower costPMIC solutions.

特性 Features

• Architecture Designed for Infotainment Applications

• Video, Image, and Graphics Processing Support
• Full-HDVideo (1920 × 1080p, 60 fps)
• Multiple Video Input and VideoOutput
• 2D and 3DGraphics

• Arm® Cortex®-A15 Microprocessor Subsystem

• C66x Floating-Point VLIW DSP
• Fully Object-Code Compatible With C67x and C64x+

• Up to Thirty-two 16 × 16-Bit Fixed-Point Multiplies per Cycle

• Up to 512KB of On-Chip L3 RAM
• Level 3 (L3) and Level 4 (L4) Interconnects
• DDR3/DDR3L Memory Interface (EMIF) Module
• Supports up to DDR-1333 (667 MHz)
• Up to 2GBAcross Single Chip Select

• Dual Arm® Cortex®-M4 Image Processing Units (IPU)
• IVA-HD Subsystem
• Display Subsystem
• Display Controller With DMAEngine and Up to Three Pipelines
• HDMI™ Encoder: HDMI 1.4a and DVI 1.0Compliant
• 2D-Graphics Accelerator (BB2D) Subsystem
• Vivante® GC320 Core

• Video Processing Engine (VPE)
• Single-Core PowerVR® SGX544 3D GPU

• One Video Input Port (VIP) Module
• Support for up to FourMultiplexed Input Ports


• General-Purpose Memory Controller (GPMC)

• Enhanced Direct Memory Access (EDMA) Controller

• 2-Port Gigabit Ethernet (GMAC)
• Up to Two External Ports

• Sixteen 32-Bit General-Purpose Timers

• 32-Bit MPU Watchdog Timer

• Six High-Speed Inter-Integrated Circuit (I2C) Ports
• HDQ™/1-Wire® Interface
• Ten Configurable UART/IrDA/CIR Modules

• Four Multichannel Serial Peripheral Interfaces (McSPI)
• Quad SPI Interface (QSPI)
• Media Local Bus Subsystem (MLBSS)

• Eight Multichannel Audio Serial Port (McASP) Modules
• SuperSpeed USB 3.0 Dual-Role Device
• High-Speed USB 2.0 Dual-Role Device
• High-Speed USB 2.0 On-The-Go

• Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD®/SDIO)
• PCI Express® 3.0 Subsystems With Two 5-Gbps Lanes
• One 2-lane Gen2-Compliant Port
• or Two 1-laneGen2-Compliant Ports
• Dual Controller Area Network (DCAN) Modules
• CAN 2.0BProtocol

• MIPI® CSI-2 Camera Serial Interface
• Up to 186 General-Purpose I/O (GPIO) Pins
• Device Security Features
• Hardware Crypto Accelerators andDMA
• Firewalls
• JTAG Lock
• SecureKeys
• Secure ROM and Boot
• Customer Programmable Keys


• Power, Reset, and Clock Management

• On-Chip Debug With CTools Technology
• 28-nm CMOS Technology

• 17 mm × 17 mm, 0.65-mm Pitch, 538-Pin BGA (CBD)
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