0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

Features 1. High Density Mounting This is a space- saving design that minimizes connector depth while ensuring an vacuum pick & place area that does not affect mountability. The smallest depth in it' s class : 3. 38mm 2. Wide Stacking Height Variations A wide variety of height variations, 1. 5

文件：1.16996 Mbytes 页数：25 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

Features 1. High Density Mounting This is a space- saving design that minimizes connector depth while ensuring an vacuum pick & place area that does not affect mountability. The smallest depth in it' s class : 3. 38mm 2. Wide Stacking Height Variations A wide variety of height variations, 1. 5

文件：1.16996 Mbytes 页数：25 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

Features 1. High Density Mounting This is a space- saving design that minimizes connector depth while ensuring an vacuum pick & place area that does not affect mountability. The smallest depth in it' s class : 3. 38mm 2. Wide Stacking Height Variations A wide variety of height variations, 1. 5

文件：1.16996 Mbytes 页数：25 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

INFINEON
MODULE

Infineon

英飞凌

上传：深圳市斌腾达科技有限公司

HIROSE/广濑
CONN

HIROSE/广濑

上传：深圳市恒佳微电子有限公司