包装：盒 类别：焊接，拆焊，返修产品 烙铁，镊子，手柄 描述：SOLDERING GUN 200W 260W 120V

ATG

包装：散装 类别：焊接，拆焊，返修产品 烙铁，镊子，手柄 描述：SOLDERING GUN 200W 260W 120V

ATG

包装：盒 类别：焊接，拆焊，返修产品 烙铁，镊子，手柄 描述：SOLDERING GUN 200W 260W 120V

ATG

DLP550HE 0.55 SVGA Digital Micromirror Device

1 Features • 0.55-inch diagonal micromirror array – SVGA (800 x 600) array – 13.68-μm micromirror pitch – ±12° micromirror tilt angle (relative to flat state) – Designed for corner illumination • LVDS input data bus • The DLP550HE chipset includes: – DLP550HE DMD – DLPC4430 controller –

文件：1.40417 Mbytes 页数：44 Pages

TI

德州仪器

0.55 XGA DMD

文件：658.99 Kbytes 页数：34 Pages

TI

德州仪器

DLP550JE 0.55-Inch XGA Digital Micromirror Device

1 Features • 0.55-inch micromirror array diagonal – XGA (1024 × 768) – 10.8-micron micromirror pitch – ±12° micromirror tilt angle (relative to flat state) – Corner illumination • 2xLVDS input data bus • The DLP550JE chipset includes: – DLP550JE DMD – DLPC4420 controller – DLPA100 contr

文件：1.17516 Mbytes 页数：40 Pages

TI

德州仪器