包装：散装 类别：焊接，拆焊，返修产品 烙铁，镊子，手柄 描述：SOLDERING GUN 200W 260W 120V

ATG

包装：盒 类别：焊接，拆焊，返修产品 烙铁，镊子，手柄 描述：SOLDERING GUN 200W 260W 120V

ATG

DLP550HE 0.55 SVGA Digital Micromirror Device

1 Features • 0.55-inch diagonal micromirror array – SVGA (800 x 600) array – 13.68-μm micromirror pitch – ±12° micromirror tilt angle (relative to flat state) – Designed for corner illumination • LVDS input data bus • The DLP550HE chipset includes: – DLP550HE DMD – DLPC4430 controller –

文件：1.40417 Mbytes 页数：44 Pages

TI

德州仪器

0.55 XGA DMD

文件：658.99 Kbytes 页数：34 Pages

TI

德州仪器

DLP550JE 0.55-Inch XGA Digital Micromirror Device

1 Features • 0.55-inch micromirror array diagonal – XGA (1024 × 768) – 10.8-micron micromirror pitch – ±12° micromirror tilt angle (relative to flat state) – Corner illumination • 2xLVDS input data bus • The DLP550JE chipset includes: – DLP550JE DMD – DLPC4420 controller – DLPA100 contr

文件：1.17516 Mbytes 页数：40 Pages

TI

德州仪器