SCXV.92/V.34/V.32bis Modem / Controller-based Modem with Worldwide SmartDAA 3 Line Side Device for Embedded Applications

Overview The Conexant®SCXV.92, SCXV.34, and SCXV.32bis modems are worldwide operational modem device sets for embedded applications that support modulations up to V.92, V.34, and V.32bis, respectively (refer to Table 1-1). All modems also support V.44/V.42bis/MNP 5 data compression for greater

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CONEXANT

V.92/V.34/V.32bis Modem in 28-Pin or 38-Pin TSSOP with CX20493 SmartDAA®

Overview\nThe Conexant®SCXV.92, SCXV.34, and SCXV.32bis modems are worldwide operational modem device sets for embedded applications that support modulations up to V.92, V.34, and V.32bis, respectively (refer to Table 1-1). All modems also support V.44/V.42bis/MNP 5 data compression for greater data •  Modulations and protocols\n−  ITU-T V.92\n♦  Modem-on-Hold (MOH)\n♦  Quick connect (QC)\n♦  PCM upstream\n−  V.90/V.34/V.32bis/V.32\n−  V.22bis/V.22/V.23/V.21\n−  V.23 reverse, V.23 half-duplex\n−  Bell 212A/Bell 103\n−  V.29 FastPOS\n−  V22bis fast connect\n−  V.80 Synchronous Access Mode\n•  Da;

Synaptics

新思

DUAL COOL??PACKAGE POWERTRENCH짰 MOSFETs

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

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Fairchild

仙童半导体

N-Channel Dual CoolTM Power Trench짰 MOSFET 60 V, 108 A, 2.3 m廓

Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：280.09 Kbytes 页数：8 Pages

Fairchild

仙童半导体

N-Channel PowerTrench짰 MOSFET 60 V, 80 A, 2.5 m廓

文件：283.61 Kbytes 页数：7 Pages

Fairchild

仙童半导体