丝印：CP7；Package：SOD-123；Zener Voltage Regulators 500 mW SOD-123 Surface Mount

Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. Specification Features  500 mW Rating on FR−4 or FR−5 Board  Wide Zener Reverse Voltage Range − 2.4

文件：157.7 Kbytes 页数：6 Pages

ONSEMI

安森美半导体

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • arcTEC™ structure on select models • solid state device • precise temperature control • quiet operation

文件：723.27 Kbytes 页数：8 Pages

CUI

CUI Inc.

Small Signal Transistors PNP - High Voltage Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：68.71 Kbytes 页数：1 Pages

Central

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • arcTEC™ structure on select models • solid state device • precise temperature control • quiet operation

文件：723.27 Kbytes 页数：8 Pages

CUI

CUI Inc.

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • arcTEC™ structure on select models • solid state device • precise temperature control • quiet operation

文件：723.27 Kbytes 页数：8 Pages

CUI

CUI Inc.

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • arcTEC™ structure on select models • solid state device • precise temperature control • quiet operation

文件：723.27 Kbytes 页数：8 Pages

CUI

CUI Inc.

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • arcTEC™ structure on select models • solid state device • precise temperature control • quiet operation

文件：723.27 Kbytes 页数：8 Pages

CUI

CUI Inc.

Small Signal Transistors NPN - Amp Switch Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 3.7 X 3.7 MILS Emitter Bonding Pad Area 4.2 X 4.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：133.98 Kbytes 页数：2 Pages

Central

PELTIER MODULE

DESCRIPTION: PELTIER MODULE FEATURES • arcTEC™ structure on select models • solid state device • precise temperature control • quiet operation

文件：723.27 Kbytes 页数：8 Pages

CUI

CUI Inc.

Small Signal Transistors PNP - High Voltage Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 22 x 22 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 3.7 x 3.7 MILS Emitter Bonding Pad Area 4.2 x 4.2 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å

文件：475.62 Kbytes 页数：2 Pages

Central