Fast Settling, Wideband Low-Gain Monolithic Op Amp

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NSC

国半

Four leaded Multiple Emitter Chip Surface Mount Package

description The CLE400F can contain three 850 nm IRED chips which feature double/double heterojunction (DDH) construction for increased quantum efficiency and reliability. This device is one example of a very broad line of devices made possible by four leaded package configuration. One to three c

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CLAIREX

LED-PHOTOCONDUCTOR ISOLATORS

Coming Soon. If you have some information on related parts, please share useful information by adding links below.

文件：74.49 Kbytes 页数：2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Wedge Base

文件：32.02 Kbytes 页数：1 Pages

VCC