Fast Settling, Wideband Low-Gain Monolithic Op Amp

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NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Four leaded Multiple Emitter Chip Surface Mount Package

description The CLE400F can contain three 850 nm IRED chips which feature double/double heterojunction (DDH) construction for increased quantum efficiency and reliability. This device is one example of a very broad line of devices made possible by four leaded package configuration. One to three c

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Clairex

LED-PHOTOCONDUCTOR ISOLATORS

Coming Soon. If you have some information on related parts, please share useful information by adding links below.

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ETC1List of Unclassifed Manufacturers

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Wedge Base

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VCC