Four leaded Multiple Emitter Chip Surface Mount Package

description The CLE400F can contain three 850 nm IRED chips which feature double/double heterojunction (DDH) construction for increased quantum efficiency and reliability. This device is one example of a very broad line of devices made possible by four leaded package configuration. One to three c

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Clairex

Four leaded Multiple Emitter Chip Surface Mount Package

Clairex

LED-PHOTOCONDUCTOR ISOLATORS

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ETC1List of Unclassifed Manufacturers

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Wedge Base

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VCC

Visual Communications Company

FORWARD REFERENCE DIODE

DESCRIPTION The CENTRAL SEMICONDUCTOR CMPD200 series types are multi-chip silicon diodes mounted in a JEDEC DO-35 case. These devices are designed for applications requiring controlled forward voltage characteristics such as voltage regulation, sensing, and comparing. This series is a direct repl

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