Fast Settling, Wideband Low-Gain Monolithic Op Amp

文件：392.67 Kbytes 页数：6 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Fast Settling, Wideband Low-Gain Monolithic Op Amp

文件：392.67 Kbytes 页数：6 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Fast Settling, Wideband Low-Gain Monolithic Op Amp

文件：392.67 Kbytes 页数：6 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司

Four leaded Multiple Emitter Chip Surface Mount Package

description The CLE400F can contain three 850 nm IRED chips which feature double/double heterojunction (DDH) construction for increased quantum efficiency and reliability. This device is one example of a very broad line of devices made possible by four leaded package configuration. One to three c

文件：115.11 Kbytes 页数：1 Pages

Clairex