MOSFETs

Unikc

旭康微

Small Signal Transistor PNP - Silicon RF Transistor Chip

PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.7 x 21.7 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 3.5 MILS DIAMETER Emitter Bonding Pad Area 3.5 x 3.5 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 10,000Å

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CENTRAL

30 cm Water Content Reflectometer

Benefits and Features Compatible with most Campbell Scientific data loggers High accuracy and high precision Fast response time Designed for long-term unattended water content monitoring Compatible with AM16/32-series multiplexers, allowing measurement of multiple sensors Probe rods ca

文件：381.43 Kbytes 页数：2 Pages

CAMPBELL

Power Transformers - Standard E Dual 115V

文件：180.7 Kbytes 页数：2 Pages

CT

Central Technologies