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详细参数
- 型号：
CHIPT1593CSE6327X1SA1
- 制造商：
Infineon Technologies AG
- 功能描述：
RF SILICON MMIC - Gel-pak, waffle pack, wafer, diced wafer on film
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
INFINEON |
22+ |
S-BD-0 |
8000 |
终端可免费供样,支持BOM配单 |
询价 | ||
INFINEON |
23+ |
S-BD-0 |
8000 |
只做原装现货 |
询价 | ||
INFINEON |
23+ |
S-BD-0 |
7000 |
询价 |
更多CHIPT1593CSE6327X1SA1供应商
更新时间2025-10-5 10:01:00
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