MULTILAYER CERAMIC CHIP CAPACITORS

文件：1.22208 Mbytes 页数：8 Pages

TDK

东电化

Commercial Grade ( Low Profile )

CGB Series Commercial Grade Low Profile Features • Available in four sizes (0201, 0402, 0603, 0805) and as thin as 0.22mm. • Capacitance offering from 0.1 ȝF and up to 10ȝF. • Ideal for height-restricted applications such as mobile phone. Applications • Smart Phone • LCD modules • Height r

文件：138.75 Kbytes 页数：1 Pages

TDK

东电化

Commercial Grade ( Low Profile )

CGB Series Commercial Grade Low Profile Features • Available in four sizes (0201, 0402, 0603, 0805) and as thin as 0.22mm. • Capacitance offering from 0.1 ȝF and up to 10ȝF. • Ideal for height-restricted applications such as mobile phone. Applications • Smart Phone • LCD modules • Height r

文件：138.63 Kbytes 页数：1 Pages

TDK

东电化

积层贴片陶瓷片式电容器

TDK

东电化

积层贴片陶瓷片式电容器

TDK

东电化

Package：0201（0603 公制）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：电容器 陶瓷电容器 描述：CAP CER 0.1UF 6.3V X5R 0201

TDK

东电化

Package：0201（0603 公制）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：电容器 陶瓷电容器 描述：CAP CER 0.1UF 4V X6S 0201

TDK

东电化

Package：0201（0603 公制）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：电容器 陶瓷电容器 描述：CAP CER 0.1UF 4V X6S 0201

TDK

东电化