Package：165-LBGA；包装：托盘 类别：集成电路（IC） 存储器 描述：IC SRAM 18MBIT PARALLEL 165FBGA

CypressCypress Semiconductor

赛普拉斯赛普拉斯半导体公司

7th Gen Intel® Kaby Lake-U Processor 3.5” Micro Module

Features • Top Layer Soldered Processor • Single DRAM Socket, Max. Up to 16GB DDR4 2133MT/s • Triple Display (Dual HDMI, Dual-Ch 18/24-bit LVDS) • Dual Expansion Slot, M.2 Key-B, Full Size mCPIe • Dual Gigabit Ethernet, HD Audio Code • TPM 2.0

文件：415.97 Kbytes 页数：1 Pages

BCM

7th Gen Intel® Core™ SoC ULT Processor i7/i5/i3 COMe Type6 Compact Module

Features • Onboard 7th Gen Intel® Core™ SoC ULT i7/i5/i3 BGA Processor • Two 260pin SODIMM DDR4 2133 SDRAM Slot up to 32GB • Support Dual Channel LVDS, DisplayPort (DP++), VGA/HDMI, optional eDP • 3 SATA (6.0GB/s), 8 USB 2.0,4 USB 3.0, 8-bit GPIO • Intel 1219LM Gigabit Ethernet • Type 6 Rev 2.1

文件：593.17 Kbytes 页数：1 Pages

BCM

Dual N-Channel PowerTrench짰 MOSFET N-Channel: 30 V, 30 A, 7.5 m廓 N-Channel: 30 V, 40 A, 2.8 m廓

文件：470.02 Kbytes 页数：12 Pages

Fairchild

仙童半导体