首页 >CF324CP>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
WhitetranslucenthighimpactUVstabilizedacryliclens | LUMINIS Lumins Inc. | LUMINIS | ||
WireTerminal | VCC Visual Communications Company | VCC | ||
DC-30GHz2-bitDigitalAttenuator KeyFeatures UltraWidebandPerformance LowInsertionLoss WideAttenuationRange SmallDieSize | QORVOQorvo, Inc 威讯联合威讯联合半导体(德州)有限公司 | QORVO | ||
QuadGroundSenseOperationalAmplifier TheCO324ismonolithicICwithfourbuilt-inoperationalamplifiersfeaturinginternalphasecompensation. Eitheradualorsinglepowersupplycanbedriven,andtheseproductscanbedrivenbyadigitalsystem5Vsinglepowersupply.Theseproductscanbeusedinawiderangeofadministrative | Ceramate Ceramate Technical | Ceramate | ||
Single-Chip1kand2kCMOSMicrocontrollers | NSCNational Semiconductor (TI) 美国国家半导体美国国家半导体公司 | NSC | ||
SmallSignalMOSFETTransistorN-ChannelEnhancement-ModeTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize21.65x21.65MILS DieThickness9.0MILS GateBondingPadArea5.5x5.5MILS SourceBondingPadArea5.9x13.8MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-12,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
N-ChannelEnhancement-ModeTransistorChip PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize21.6x21.6MILS DieThickness5.9MILS GateBondingPadArea5.5x5.5MILS SourceBondingPadArea5.9x13.8MILS TopSideMetalizationAl-30,000Å BackSideMetalizationAu-12,000Å | CentralCentral Semiconductor Corp 美国中央半导体 | Central | ||
GERMANIUMPNPTRANSISTORS | ETC1List of Unclassifed Manufacturers etc未分类制造商未分类制造商 | ETC1 | ||
HystereticCurrent-ModeController | CHERRY Cherry Semiconductor Corporation | CHERRY | ||
Safetyswitch,generalduty,fusible,200A,3poles,60hp,240VAC,NEMA1,neutralfactoryinstalled | SCHNEIDERSchneider Electric 施耐德施耐德电气 | SCHNEIDER |
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