CSEB0530H

MoldedPowerInductor

Features： ▪Corematerial:Alloypowder ▪Coreandwindingloss: Seehttps://www.codaca.com/DesignTool_Power-Inductor-Loss- Comparison.html ▪Enviromental:RoHS,Reachcompliant,Halogenfree ▪Weight:0.51g ▪MoistureSensitivity:Level(MSL)1 (unlimitedfloorlifeat5～40℃,RH≤70relativ

CSHB0530R

MoldingPowerChoke

Outline: ▪Magneticshieldedstructure:excellentresistancetoelectro Magmeticinterference(EMI) ▪Acompositestructure,ultralowbuzznoise ▪Lowloss,highefficiency,wideapplicationfrequency ▪Lightweightdesign,savespace,suitableforhighdensitySMT Features： ▪Corematerial:Al

EL0530

8PINSOPDUALCHANNELHIGHSPEED1Mbit/sTRANSISTORPHOTOCOUPLER

ENA0530

P-ChannelSiliconMOSFETGeneral-PurposeSwitchingDeviceApplications

General-PurposeSwitchingDeviceApplications Features •4Vdrive. •Compositetypewith2MOSFETscontainedinasinglepackage,facilitatinghigh-densitymounting.

FCSP0530ETR

FlipKY,0.5A

FCSP0530ETR

chipscalepackagingtodeliverSchottkydiodes

FCSP0530TR

ChipScalePackageSchottkyBarrierRectifier,0.5A

FCSP0530TR

FlipKY짰ChipScalePackageSchottkyBarrierRectifier,0.5A

FEATURES •UltralowVFtofootprintarea •Verylowprofile(

FCUL0530

IdealforDC-DCconverterapplications

FDR0530

SurfaceMountSchottkyPowerRectifier