CC3135数据手册RF/IF射频/中频RFID的射频收发器IC规格书PDF

描述 Description

Connect any microcontroller (MCU) to the Internet of Things (IoT) with the CC3135 device, a dual-band wireless network processor from Texas Instruments. The CC3135 Wi-Fi® Internet-on-a chip™ device contains an Arm Cortex-M3 MCU dedicated to Wi-Fi® and internet protocols, in order to offload networking activities from the host MCU. The subsystem includes a dual-band 802.11a/b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption and a built in power management for best in class low power performance.

The Wi-Fi CERTIFIED® CC3135 device dramatically simplifies the implementation of low-power, with the integrated Wi-Fi Alliance® IoT low power feature.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features include:802.11a (5 GHz) support BLE/2.4 GHz radio coexistence Antenna selection Enhanced security withFIPS140-2 Level 1 certification and more. For exact status of FIPS certification for a specific part number, refer to https://csrc.nist.gov/publications/fips. Up to 16 concurrent secure sockets Certificate sign request (CSR) Online certificate status protocol (OCSP) Wi-Fi Alliance® certified for IoT applications with low-power capabilities and more Hostless mode for offloading template packet transmissions Improved fast scan

The CC3135 device is delivered with a slim and user-friendly host driver to simplify the integration and development of networking applications. The host driver can easily be ported to most platforms and operating systems (OS). The driver has a small memory footprint and can run on 8-bit, 16-bit, or 32-bit microcontrollers with any clock speed (no performance or real-time dependency).

The CC3135 device is part of the SimpleLink™ MCU platform, a common, easy-to-use development environment based on a single core software development kit (SDK), rich tool set, reference designs and E2E™ community which supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz and host MCUs. For more information, visitwww.ti.com/simplelink .

特性 Features

• Integrated dual-band Wi-Fi and internet protocols
• 802.11a/b/g/n: 2.4 GHz and 5 GHz
• FIPS 140-2 Level 1 certification
• Rich set of IoT security features helps developers protect data
• Low-power modes for battery powered application
• Coexistence with 2.4-GHz radios
• Industrial temperature: –40°C to +85°C
• Transferable Wi-Fi Alliance certification
• Wi-Fi network processor subsystem:
• Wi-Fi core:
• 802.11a/b/g/n 2.4 GHz and 5 GHz
• Modes:
• Access point (AP)
• Station (STA)
• Wi-Fi Direct (only supported on 2.4 GHz)

• Security:
• WEP
• WPA™/ WPA2™ PSK
• WPA2 Enterprise
• WPA3™ Personal
• WPA3™ Enterprise


• Internet and application protocols:
• HTTPs server, mDNS, DNS-SD, DHCP
• IPv4 and IPv6 TCP/IP stack
• 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)

• Built-in power management subsystem:
• Configurable low-power profiles (always, intermittent, tag)
• Advanced low-power modes
• Integrated DC/DC regulators


• Multilayered security features:
• Separate execution environments
• Networking security
• Device identity and key
• Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
• Application-level security (encryption, authentication, access control)
• Initial secure programming
• Software tamper detection
• Secure boot
• Certificate signing request (CSR)
• Unique per device key pair

• Application throughput:
• UDP: 16 Mbps, TCP: 13 Mbps
• Peak: 72 Mbps

• Power-management subsystem
• Integrated DC/DC converters support a wide range of supply voltage:
• VBAT wide-voltage mode: 2.1 V to 3.6 V
• VIO is always tied with VBAT

• Advanced low-power modes:
• Shutdown: 1 µA, hibernate: 4 µA
• Low-power deep sleep (LPDS): 120 µA
• Idle connected (MCU in LPDS): 710 µA
• RX traffic (MCU active): 53 mA
• TX traffic (MCU active): 223 mA


• Wi-Fi TX power:
• 2.4 GHz: 18.0 dBm at 1 DSSS
• 5 GHz: 18.1 dBm at 6 OFDM

• Wi-Fi RX sensitivity:
• 2.4 GHz: –96 dBm at 1 DSSS
• 5 GHz: –92 dBm at 6 OFDM

• Clock source:
• 40.0-MHz crystal with internal oscillator
• 32.768-kHz crystal or external RTC

• RGK package
• 64-pin, 9-mm × 9-mm very thin quad flat nonleaded (VQFN) package, 0.5-mm pitch

• Device supports SimpleLink™ MCU Platform developer’s ecosystem