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CC3130数据手册RF/IF射频/中频RFID的射频收发器IC规格书PDF

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厂商型号

CC3130

参数属性

CC3130 封装/外壳为64-VFQFN 裸露焊盘;包装为托盘;类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:SIMPLELINK ARM CORTEX-M3 WI-FI N

功能描述

具有共存性、WPA3 和 16 个 TLS 插槽的 SimpleLink™ Arm Cortex-M3 Wi-Fi® 网络处理器

封装外壳

64-VFQFN 裸露焊盘

制造商

TI Texas Instruments

中文名称

德州仪器 美国德州仪器公司

数据手册

下载地址下载地址二

更新时间

2025-8-7 23:00:00

人工找货

CC3130价格和库存,欢迎联系客服免费人工找货

CC3130规格书详情

描述 Description

Connect any microcontroller (MCU) to the Internet of Things (IoT) with the CC3130 device from Texas Instruments. The SimpleLink™ Wi-Fi CC3130 Internet-on-a chip™ device contains an Arm Cortex-M3 MCU dedicated to Wi-Fi® and internet protocols, in order to offload networking activities from the host MCU. The subsystem includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption and a built in power management for best in class low power performance.

The Wi-Fi CERTIFIED® CC3130 device dramatically simplifies the implementation of low-power, with the integrated Wi-Fi Alliance® IoT low power feature.

This generation introduces new capabilities that further simplify the connectivity of things to the internet. The main new features include: Bluetooth Low Energy and Wi-Fi 2.4-GHz radio coexistence (CC13x2/CC26x2) Antenna selection Up to 16 concurrent secure sockets Certificate sign request (CSR) Online certificate status protocol (OCSP) Wi-Fi Alliance certified IoT power-saving features (such as BSS max idle, DMS, and proxy ARP) Hostless mode for offloading template packet transmissions Network-assisted roaming

The CC3130 device is delivered with a slim and user-friendly host driver to simplify the integration and development of networking applications. The host driver can easily be ported to most platforms and operating systems (OS). The driver has a small memory footprint and can run on 8-bit, 16-bit, or 32-bit microcontrollers with any clock speed (no performance or real-time dependency).

The CC3130 device is part of the SimpleLink™ MCU platform, a common, easy-to-use development environment based on a single core software development kit (SDK), rich tool set, reference designs and E2E™ community which supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz and host MCUs. For more information, visitwww.ti.com/simplelink .

特性 Features

• Integrated Wi-Fi and internet protocols
• Coexistence with BLE radios (CC13x2/CC26x2)
• Rich set of IoT security features helps developers protect data
• Low-power modes for battery powered application
• Network-assisted roaming
• Industrial temperature: –40°C to +85°C
• Transferable Wi-Fi Alliance certification
• Wi-Fi network processor subsystem:
• Wi-Fi core:
• 802.11b/g/n 2.4 GHz
• Modes:
• Access point (AP)
• Station (STA)
• Wi-Fi Direct

• Security:
• WEP
• WPA™/ WPA2™ PSK
• WPA2 Enterprise
• WPA3™ Personal
• WPA3™ Enterprise


• Internet and application protocols:
• HTTPs server, mDNS, DNS-SD, DHCP
• IPv4 and IPv6 TCP/IP stack
• 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)

• Built-in power management subsystem:
• Configurable low-power profiles (always, intermittent, tag)
• Advanced low-power modes
• Integrated DC/DC regulators


• Multilayered security features:
• Separate execution environments
• Networking security
• Device identity and key
• Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
• File-system security (encryption, authentication, access control)
• Initial secure programming
• Software tamper detection
• Certificate signing request (CSR)
• Unique per device key pair

• Application throughput:
• UDP: 16 Mbps, TCP: 13 Mbps
• Peak: 72 Mbps

• Power-Management Subsystem:
• Integrated DC/DC converters support a wide range of supply voltage:
• VBAT wide-voltage mode: 2.1 V to 3.6 V
• VIO is always tied with VBAT

• Advanced low-power modes:
• Shutdown: 1 µA, hibernate: 4 µA
• Low-power deep sleep (LPDS): 120 µA
• Idle connected (MCU in LPDS): 710 µA
• RX traffic (MCU active): 53 mA
• TX traffic (MCU active): 223 mA


• Wi-Fi TX power:
• 18.0 dBm at 1 DSSS
• 14.5 dBm at 54 OFDM

• Wi-Fi RX sensitivity:
• –96 dBm at 1 DSSS
• –74.5 dBm at 54 OFDM

• Clock source:
• 40.0-MHz crystal with internal oscillator
• 32.768-kHz crystal or external RTC

• RGK package
• 64-pin, 9-mm × 9-mm very thin quad flat nonleaded (VQFN) package, 0.5-mm pitch

• Device supports SimpleLink™ MCU Platform developer’s ecosystem

技术参数

  • 制造商编号

    :CC3130

  • 生产厂家

    :TI

  • Package (mm)

    :9x9 QFN

  • Protocols

    :Wi-Fi 2.4 GHz

  • Throughput (Max) (Mbps)

    :16

  • Security

    :Device identity

  • Features

    :802.11bgn

供应商 型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
SMD63P
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
TI(德州仪器)
24+
NA/
8735
原厂直销,现货供应,账期支持!
询价
TI
23+
NA
6800
原装正品,力挺实单
询价
Texas Instruments
20+
VQFN-64
29860
TI微控制器MCU-可开原型号增税票
询价
TI(德州仪器)
2024+
VQFN-64
500000
诚信服务,绝对原装原盘
询价
TI
24+
QFM-63
10000
低于市场价,实单必成,QQ1562321770
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
TI(德州仪器)
24+
Module
32000
全新原厂原装正品现货,低价出售,实单可谈
询价
TI(德州仪器)
24+
N/A
6000
原装,正品
询价
Texas Instruments
25+
原封装
33220
郑重承诺只做原装进口现货
询价