CC3130数据手册RF/IF射频/中频RFID的射频收发器IC规格书PDF

厂商型号 |
CC3130 |
参数属性 | CC3130 封装/外壳为64-VFQFN 裸露焊盘;包装为托盘;类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:SIMPLELINK ARM CORTEX-M3 WI-FI N |
功能描述 | 具有共存性、WPA3 和 16 个 TLS 插槽的 SimpleLink™ Arm Cortex-M3 Wi-Fi® 网络处理器 |
封装外壳 | 64-VFQFN 裸露焊盘 |
制造商 | TI Texas Instruments |
中文名称 | 德州仪器 美国德州仪器公司 |
数据手册 | |
更新时间 | 2025-8-7 23:00:00 |
人工找货 | CC3130价格和库存,欢迎联系客服免费人工找货 |
CC3130规格书详情
描述 Description
Connect any microcontroller (MCU) to the Internet of Things (IoT) with the CC3130 device from Texas Instruments. The SimpleLink™ Wi-Fi CC3130 Internet-on-a chip™ device contains an Arm Cortex-M3 MCU dedicated to Wi-Fi® and internet protocols, in order to offload networking activities from the host MCU. The subsystem includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption and a built in power management for best in class low power performance.
The Wi-Fi CERTIFIED® CC3130 device dramatically simplifies the implementation of low-power, with the integrated Wi-Fi Alliance® IoT low power feature.
This generation introduces new capabilities that further simplify the connectivity of things to the internet. The main new features include: Bluetooth Low Energy and Wi-Fi 2.4-GHz radio coexistence (CC13x2/CC26x2) Antenna selection Up to 16 concurrent secure sockets Certificate sign request (CSR) Online certificate status protocol (OCSP) Wi-Fi Alliance certified IoT power-saving features (such as BSS max idle, DMS, and proxy ARP) Hostless mode for offloading template packet transmissions Network-assisted roaming
The CC3130 device is delivered with a slim and user-friendly host driver to simplify the integration and development of networking applications. The host driver can easily be ported to most platforms and operating systems (OS). The driver has a small memory footprint and can run on 8-bit, 16-bit, or 32-bit microcontrollers with any clock speed (no performance or real-time dependency).
The CC3130 device is part of the SimpleLink™ MCU platform, a common, easy-to-use development environment based on a single core software development kit (SDK), rich tool set, reference designs and E2E™ community which supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz and host MCUs. For more information, visitwww.ti.com/simplelink .
特性 Features
• Integrated Wi-Fi and internet protocols
• Coexistence with BLE radios (CC13x2/CC26x2)
• Rich set of IoT security features helps developers protect data
• Low-power modes for battery powered application
• Network-assisted roaming
• Industrial temperature: –40°C to +85°C
• Transferable Wi-Fi Alliance certification
• Wi-Fi network processor subsystem:
• Wi-Fi core:
• 802.11b/g/n 2.4 GHz
• Modes:
• Access point (AP)
• Station (STA)
• Wi-Fi Direct
• Security:
• WEP
• WPA™/ WPA2™ PSK
• WPA2 Enterprise
• WPA3™ Personal
• WPA3™ Enterprise
• Internet and application protocols:
• HTTPs server, mDNS, DNS-SD, DHCP
• IPv4 and IPv6 TCP/IP stack
• 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
• Built-in power management subsystem:
• Configurable low-power profiles (always, intermittent, tag)
• Advanced low-power modes
• Integrated DC/DC regulators
• Multilayered security features:
• Separate execution environments
• Networking security
• Device identity and key
• Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
• File-system security (encryption, authentication, access control)
• Initial secure programming
• Software tamper detection
• Certificate signing request (CSR)
• Unique per device key pair
• Application throughput:
• UDP: 16 Mbps, TCP: 13 Mbps
• Peak: 72 Mbps
• Power-Management Subsystem:
• Integrated DC/DC converters support a wide range of supply voltage:
• VBAT wide-voltage mode: 2.1 V to 3.6 V
• VIO is always tied with VBAT
• Advanced low-power modes:
• Shutdown: 1 µA, hibernate: 4 µA
• Low-power deep sleep (LPDS): 120 µA
• Idle connected (MCU in LPDS): 710 µA
• RX traffic (MCU active): 53 mA
• TX traffic (MCU active): 223 mA
• Wi-Fi TX power:
• 18.0 dBm at 1 DSSS
• 14.5 dBm at 54 OFDM
• Wi-Fi RX sensitivity:
• –96 dBm at 1 DSSS
• –74.5 dBm at 54 OFDM
• Clock source:
• 40.0-MHz crystal with internal oscillator
• 32.768-kHz crystal or external RTC
• RGK package
• 64-pin, 9-mm × 9-mm very thin quad flat nonleaded (VQFN) package, 0.5-mm pitch
• Device supports SimpleLink™ MCU Platform developer’s ecosystem
技术参数
- 制造商编号
:CC3130
- 生产厂家
:TI
- Package (mm)
:9x9 QFN
- Protocols
:Wi-Fi 2.4 GHz
- Throughput (Max) (Mbps)
:16
- Security
:Device identity
- Features
:802.11bgn
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI(德州仪器) |
24+ |
SMD63P |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | ||
TI(德州仪器) |
24+ |
NA/ |
8735 |
原厂直销,现货供应,账期支持! |
询价 | ||
TI |
23+ |
NA |
6800 |
原装正品,力挺实单 |
询价 | ||
Texas Instruments |
20+ |
VQFN-64 |
29860 |
TI微控制器MCU-可开原型号增税票 |
询价 | ||
TI(德州仪器) |
2024+ |
VQFN-64 |
500000 |
诚信服务,绝对原装原盘 |
询价 | ||
TI |
24+ |
QFM-63 |
10000 |
低于市场价,实单必成,QQ1562321770 |
询价 | ||
TI/德州仪器 |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
询价 | ||
TI(德州仪器) |
24+ |
Module |
32000 |
全新原厂原装正品现货,低价出售,实单可谈 |
询价 | ||
TI(德州仪器) |
24+ |
N/A |
6000 |
原装,正品 |
询价 | ||
Texas Instruments |
25+ |
原封装 |
33220 |
郑重承诺只做原装进口现货 |
询价 |