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CC3130中文资料具有共存性、WPA3 和 16 个 TLS 插槽的 SimpleLink™ Arm Cortex-M3 Wi-Fi® 网络处理器数据手册TI规格书

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厂商型号

CC3130

参数属性

CC3130 封装/外壳为64-VFQFN 裸露焊盘;包装为托盘;类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:SIMPLELINK ARM CORTEX-M3 WI-FI N

功能描述

具有共存性、WPA3 和 16 个 TLS 插槽的 SimpleLink™ Arm Cortex-M3 Wi-Fi® 网络处理器

封装外壳

64-VFQFN 裸露焊盘

制造商

TI Texas Instruments

中文名称

德州仪器 美国德州仪器公司

数据手册

下载地址下载地址二

更新时间

2025-9-26 16:04:00

人工找货

CC3130价格和库存,欢迎联系客服免费人工找货

CC3130规格书详情

描述 Description

Connect any microcontroller (MCU) to the Internet of Things (IoT) with the CC3130 device from Texas Instruments. The SimpleLink™ Wi-Fi CC3130 Internet-on-a chip™ device contains an Arm Cortex-M3 MCU dedicated to Wi-Fi® and internet protocols, in order to offload networking activities from the host MCU. The subsystem includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption and a built in power management for best in class low power performance.

The Wi-Fi CERTIFIED® CC3130 device dramatically simplifies the implementation of low-power, with the integrated Wi-Fi Alliance® IoT low power feature.

This generation introduces new capabilities that further simplify the connectivity of things to the internet. The main new features include: Bluetooth Low Energy and Wi-Fi 2.4-GHz radio coexistence (CC13x2/CC26x2) Antenna selection Up to 16 concurrent secure sockets Certificate sign request (CSR) Online certificate status protocol (OCSP) Wi-Fi Alliance certified IoT power-saving features (such as BSS max idle, DMS, and proxy ARP) Hostless mode for offloading template packet transmissions Network-assisted roaming

The CC3130 device is delivered with a slim and user-friendly host driver to simplify the integration and development of networking applications. The host driver can easily be ported to most platforms and operating systems (OS). The driver has a small memory footprint and can run on 8-bit, 16-bit, or 32-bit microcontrollers with any clock speed (no performance or real-time dependency).

The CC3130 device is part of the SimpleLink™ MCU platform, a common, easy-to-use development environment based on a single core software development kit (SDK), rich tool set, reference designs and E2E™ community which supports Wi-Fi®, Bluetooth® low energy, Sub-1 GHz and host MCUs. For more information, visitwww.ti.com/simplelink .

特性 Features

• Integrated Wi-Fi and internet protocols
• Rich set of IoT security features helps developers protect data
• Network-assisted roaming
• Transferable Wi-Fi Alliance certification
• Wi-Fi core:
• Modes:
• Station (STA)
• Security:
• WPA™/ WPA2™ PSK
• WPA3™ Personal
• Internet and application protocols:
• IPv4 and IPv6 TCP/IP stack
• Built-in power management subsystem:
• Advanced low-power modes
• Multilayered security features:
• Networking security
• Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
• Initial secure programming
• Certificate signing request (CSR)
• Application throughput:
• Peak: 72 Mbps
• Power-Management Subsystem:
• VBAT wide-voltage mode: 2.1 V to 3.6 V
• Advanced low-power modes:
• Low-power deep sleep (LPDS): 120 µA
• RX traffic (MCU active): 53 mA
• Wi-Fi TX power:
• 14.5 dBm at 54 OFDM
• Wi-Fi RX sensitivity:
• –74.5 dBm at 54 OFDM
• Clock source:
• 32.768-kHz crystal or external RTC
• RGK package
• Device supports SimpleLink™ MCU Platform developer’s ecosystem

技术参数

  • 制造商编号

    :CC3130

  • 生产厂家

    :TI

  • Package (mm)

    :9x9 QFN

  • Protocols

    :Wi-Fi 2.4 GHz

  • Throughput (Max) (Mbps)

    :16

  • Security

    :Device identity

  • Features

    :802.11bgn

供应商 型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
N/A
6000
原装,正品
询价
Texas Instruments
25+
原封装
33220
郑重承诺只做原装进口现货
询价
TI
23+
NA
6800
原装正品,力挺实单
询价
TI(德州仪器)
24+
Module
32000
全新原厂原装正品现货,低价出售,实单可谈
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
TI/德州仪器
23+
VQFN-64
5000
只有原装,欢迎来电咨询!
询价
TI(德州仪器)
24+
N/A
6000
原厂原装现货订货价格优势终端BOM表可配单提供样品
询价
TI(德州仪器)
23+
N/A
6000
公司只做原装,可来电咨询
询价
TI/德州仪器
23+
VQFN-64
2500
原装正品,支持实单
询价
TI(德州仪器)
2022+原装正品
VQFN-64
18000
支持工厂BOM表配单 公司只做原装正品货
询价