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CC2674R10_V01

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674R106T0RGZ

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674R106T0RGZ

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674R106T0RGZR

丝印:CC2674R106;Package:VQFN;CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674R106T0RGZR

丝印:CC2674R106;Package:VQFN;CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674R106T0RSK

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674R106T0RSK

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674R106T0RSKR

丝印:CC2674R106;Package:VQFN;CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

技术参数

  • Features:

    15.4G PHY

  • Peripherals:

    12-bit ADC 8-channel

  • Rating:

    Catalog

  • Flash memory (kByte):

    1024

  • RAM (kByte):

    296

  • Number of GPIOs:

    42

  • Security:

    AES 128- and 256-bit cryptographic accelerator

  • Sensitivity (best) (dBm):

    -104

  • Operating temperature range (°C):

    -40 to 105

  • 封装:

    VQFN (RGZ)

  • 引脚:

    48

  • 尺寸:

    49 mm² 7 x 7

供应商型号品牌批号封装库存备注价格
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
TI/德州仪器
25+
原厂封装
9999
询价
TI/德州仪器
25+
原厂封装
10280
询价
AVASEM
24+
DIP40
500000
行业低价,代理渠道
询价
Y&Y
两年内
NA
1015
实单价格可谈
询价
TI/德州仪器
23+
SOP8
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
TI
2023+
8700
原装现货
询价
TUSONIX
10
全新原装 货期两周
询价
KINGBRIGHT
23+
NA
19960
只做进口原装,终端工厂免费送样
询价
LAIRD
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
更多CC2674R10供应商 更新时间2025-7-28 15:20:00