| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Marking：CC2674P106；Package：VQFN；CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TITexas Instruments 德州仪器美国德州仪器公司 | TI | ||
Marking：CC2674P106；Package：VQFN；CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器美国德州仪器公司 | TI1 | ||
Marking：CC2674P106；Package：VQFN；CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器美国德州仪器公司 | TI1 |
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