CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640R2F；Package：VQFN(RHB)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640R2F；Package：VQFN(RHB)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640R2F；Package：VQFN(RHB)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640R2F；Package：VQFN(RHB)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640R2F；Package：VQFN(RHB)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

丝印：CC2640R2F；Package：VQFN(RHB)；CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful Arm® Cortex®-M3 – EEMBC CoreMark® score: 142 – Up to 48-MHz clock speed – 275KB of nonvolatile memory including 128KB of in-system Programmable Flash – Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM – 8KB of SRAM for cache or sys

文件：4.60043 Mbytes 页数：74 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes 页数：64 Pages

TI

德州仪器

SimpleLink Bluetooth low energy Wireless MCU

文件：1.97981 Mbytes 页数：64 Pages

TI

德州仪器

Package：32-VFQFN 裸露焊盘；包装：管件 类别：RF/IF，射频/中频和 RFID 射频收发器 IC 描述：IC RF TXRX+MCU BLUETOOTH 32VFQFN

TI

德州仪器