丝印：CC2640F128；Package：VQFN(RSM)；CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器

丝印：CC2640F128；Package：VQFN；CC2640 SimpleLink Bluetooth Smart Wireless MCU

文件：1.75518 Mbytes 页数：51 Pages

TI

德州仪器

丝印：CC2640F128；Package：VQFN(RSM)；CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器

丝印：CC2640F128；Package：VQFN(RSM)；CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器

丝印：CC2640F128；Package：VQFN(RSM)；CC2640 SimpleLink™ Bluetooth® Wireless MCU

1 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultralow-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air Upgrade (OTA) •

文件：3.81647 Mbytes 页数：65 Pages

TI

德州仪器

Package：32-VFQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 射频收发器 IC 描述：IC RF TXRX+MCU BLUETOOTH 32VFQFN

TI

德州仪器