丝印：CC2540TF256；Package：VQFN；CC2540T Extended Industrial Temperature Bluetooth® Smart Wireless MCU

1.1 Features 1 • True Single-Chip BLE Solution: CC2540T Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, and so forth • Operating Temperature up to 125°C • 6-mm × 6-mm Package • RF – Bluetooth® Low Energy Technology Compatible

文件：1.09327 Mbytes 页数：37 Pages

TI

德州仪器

Extended Industrial Temperature Bluetooth Smart Wireless MCU

文件：1.0235 Mbytes 页数：37 Pages

TI

德州仪器

丝印：CC2540TF256；Package：VQFN；CC2540T Extended Industrial Temperature Bluetooth® Smart Wireless MCU

1.1 Features 1 • True Single-Chip BLE Solution: CC2540T Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, and so forth • Operating Temperature up to 125°C • 6-mm × 6-mm Package • RF – Bluetooth® Low Energy Technology Compatible

文件：1.09327 Mbytes 页数：37 Pages

TI

德州仪器

丝印：CC2540TF256；Package：VQFN；CC2540T Extended Industrial Temperature Bluetooth® Smart Wireless MCU

1.1 Features 1 • True Single-Chip BLE Solution: CC2540T Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, and so forth • Operating Temperature up to 125°C • 6-mm × 6-mm Package • RF – Bluetooth® Low Energy Technology Compatible

文件：1.09327 Mbytes 页数：37 Pages

TI

德州仪器

Package：40-VFQFN 裸露焊盘；包装：托盘 类别：RF/IF，射频/中频和 RFID 射频收发器 IC 描述：IC RF TXRX+MCU BLUETOOTH 40VFQFN

TI

德州仪器