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CC2340R5-Q1

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

文件:1.75855 Mbytes 页数:54 Pages

TI

德州仪器

CC2340R5-Q1

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.63739 Mbytes 页数:69 Pages

TI

德州仪器

CC2340R5-Q1

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.65151 Mbytes 页数:72 Pages

TI

德州仪器

CC2340R5-Q1

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

文件:2.21766 Mbytes 页数:63 Pages

TI

德州仪器

CC2340R5-Q1

CC2340R5 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:3.47433 Mbytes 页数:69 Pages

TI

德州仪器

CC2340R5-Q1

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:2.60305 Mbytes 页数:59 Pages

TI

德州仪器

CC2340R5-Q1

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.42691 Mbytes 页数:75 Pages

TI

德州仪器

CC2340R5-Q1

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:3.50774 Mbytes 页数:64 Pages

TI

德州仪器

CC2340R5-Q1

CC2340R SimpleLink™ Family of 2.4GHz Wireless MCUs

1 Features Wireless microcontroller • Optimized 48MHz Arm® Cortex®-M0+ processor • Up to 512KB of in-system programmable flash • 12KB of ROM for bootloader and drivers • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4GHz RF transceiver compatible with Bluetoot

文件:3.98509 Mbytes 页数:78 Pages

TI

德州仪器

CC2340R5-Q1

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.96385 Mbytes 页数:75 Pages

TI

德州仪器

技术参数

  • Protocols:

    Bluetooth 5.2 Low Energy

  • Features:

    AEC-Q100 Grade 2 qualified

  • Peripherals:

    1 SPI

  • Rating:

    Automotive

  • Operating temperature range (°C):

    -40 to 125

  • 封装:

    VQFN (RHB)

  • 引脚:

    32

  • 尺寸:

    25 mm² 5 x 5

供应商型号品牌批号封装库存备注价格
Silicontra(硅传科技)
23+
SMD,21x15mm
500
通信模块 /百分百原装现货
询价
CHIPCON
25+
DIP-14
18000
原厂直接发货进口原装
询价
24+
TQFP
6430
原装现货/欢迎来电咨询
询价
TI/德州仪器
2447
QFN
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
询价
TI/德州仪器
23+
QFN48
50000
全新原装正品现货,支持订货
询价
CHIP
23+
QFN48
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
询价
MIC/ATM主营
24+
主打单片机
500000
行业低价,代理渠道
询价
TI/德州仪器
19+
QFN48
250
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
CHIPCON
2406+
1850
诚信经营!进口原装!量大价优!
询价
更多CC2340R5-Q1供应商 更新时间2025-10-6 10:05:00