LEDs

• Chip area 1:1.1 aspect ratio: matched to TI’s 0.55” XGA DLP for 3D printing applications • Low thermal resistance package, Rth, j-c = 1.6°C/W • Typical peak wavelength 405 nm • 6.6W typical optical power • Operation at up to 6A DC • Low-profile window for efficient coupling into optical sy

文件：1.46584 Mbytes 页数：11 Pages

Luminus

朗明纳斯

LEDs

• Chip area 1:1.1 aspect ratio: matched to TI’s 0.55” XGA DLP for 3D printing applications • Low thermal resistance package, Rth, j-c = 1.6°C/W • Typical peak wavelength 405 nm • 6.6W typical optical power • Operation at up to 6A DC • Low-profile window for efficient coupling into optical sy

文件：1.46584 Mbytes 页数：11 Pages

Luminus

朗明纳斯

紫外线LED(UVLED)

Luminus

朗明纳斯

Package：模块；包装：散装 类别：光电器件 LED 发射器 - 红外，紫外，可见光 描述：LED

Luminus Devices Inc.

Package：模块；包装：散装 类别：光电器件 LED 发射器 - 红外，紫外，可见光 描述：LED

Luminus Devices Inc.