Electric Double Layer Capacitors

ELNA

伊娜

丝印：CB1168；Package：TSSOP；DUAL DIFFERENTIAL DRIVERS AND RECEIVERS

1FEATURES • Meet or Exceed Standards TIA/EIA-422-B and ITU Recommendation V.11 • BiCMOS Process Technology • Low Supply-Current Requirements: 9 mA Max • Low Pulse Skew • Receiver Input Impedance . . . 17 kΩ Typ • Receiver Input Sensitivity . . . ±200 mV • Receiver Common-Mode Input Voltage

文件：921.02 Kbytes 页数：26 Pages

TI

德州仪器

丝印：CB1168；Package：TSSOP；DUAL DIFFERENTIAL DRIVERS AND RECEIVERS

1FEATURES • Meet or Exceed Standards TIA/EIA-422-B and ITU Recommendation V.11 • BiCMOS Process Technology • Low Supply-Current Requirements: 9 mA Max • Low Pulse Skew • Receiver Input Impedance . . . 17 kΩ Typ • Receiver Input Sensitivity . . . ±200 mV • Receiver Common-Mode Input Voltage

文件：921.02 Kbytes 页数：26 Pages

TI

德州仪器

丝印：CB1168；Package：TSSOP；DUAL DIFFERENTIAL DRIVERS AND RECEIVERS

文件：1.02571 Mbytes 页数：21 Pages

TI

德州仪器

丝印：CB1168；Package：TSSOP；DUAL DIFFERENTIAL DRIVERS AND RECEIVERS

文件：1.02571 Mbytes 页数：21 Pages

TI

德州仪器

丝印：CB1168；Package：TSSOP；DUAL DIFFERENTIAL DRIVERS AND RECEIVERS

文件：1.02571 Mbytes 页数：21 Pages

TI

德州仪器

Z=1000Ohm@100MHz, 25%, 1.5Ohm, 50mAmp Max. SMD Ferrite Bead

Multilayer chip beads are SMD components that cover a wide impedance characteristic.To suppress EMI/RFI and to prevent self-oscillation in electronic products.These small size chips generate high impedance.Low DC resistance structure of electrode prevents wasteful electric power consumption.Applicat

ITG

RF射频同轴连接器

LTI

菱奇半导体

包装：盒 类别：测试与计量 设备 - 电气检测仪、电流探头 描述：CIRCUIT BREAKER FINDER

FLIR Extech

包装：散装 类别：开关 拨动开关 描述：SWITCH TOGGLE

CARLINGTECH

海洋技术