Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

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amkor

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ChipArray짰 Packages

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Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.

FEATURES Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities Lowest cost using Amkor standard CABGA bill of materials selection 1.

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TI
HTSSOP16

TI

德州仪器

上传：深圳市金芯世纪电子有限公司

CHIPANAL
SOP8

CHIPANAL

上传：深圳市恒科翔业电子有限公司