MULTILAYER CERAMIC CHIP CAPACITORS

■FEATURES ◯Unique structure achieves high capacitance, high reliability and low resistance. ◯Metal frame relieves mechanical stress and thermal shock. ◯Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ◯Qualifie

文件：416.33 Kbytes 页数：6 Pages

TDK

东电化

积层贴片陶瓷片式电容器

TDK

东电化

Multilayer Ceramic Chip Capacitors

文件：200.01 Kbytes 页数：3 Pages

TDK

东电化

HTSSOP16

TI

德州仪器

上传：深圳市金芯世纪电子有限公司

SOP8

CHIPANAL

上传：深圳市恒科翔业电子有限公司